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首页> 外文期刊>IEEE Transactions on Semiconductor Manufacturing >Single-wafer cluster tool performance: an analysis of the effects of redundant chambers and revisitation sequences on throughput
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Single-wafer cluster tool performance: an analysis of the effects of redundant chambers and revisitation sequences on throughput

机译:单晶圆机群工具性能:分析冗余腔室和重新访问顺序对吞吐量的影响

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摘要

Recent trends in the semiconductor industry indicate the need to explore alternatives to batch-wafer manufacturing. One proposed alternative is a micro-factory based on cluster tools. This paper presents an analysis of the effect of redundant chambers and chamber revisitation process sequences on the throughput in an individual cluster tool. Theoretical models which quantify the time required to process a lot of wafers in a cluster tool are developed for these situations. The differences between scheduling algorithms which use the load-lock as a queue and those that do not are also explored. Finally, the models developed in the work are integrated into a model which bounds the minimum theoretical turn-around-time which can be achieved in a cluster based fab.
机译:半导体行业的最新趋势表明,需要探索批量晶圆制造的替代方法。一种建议的替代方法是基于群集工具的微型工厂。本文介绍了在单个群集工具中冗余腔室和腔室重新处理过程顺序对吞吐量的影响的分析。针对这些情况,开发了用于量化在群集工具中处理大量晶圆所需时间的理论模型。还探讨了使用负载锁定作为队列的调度算法与未使用调度算法的调度算法之间的差异。最后,在工作中开发的模型被集成到一个模型中,该模型限定了在基于集群的晶圆厂中可以实现的最小理论周转时间。

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