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首页> 外文期刊>IEEE Transactions on Semiconductor Manufacturing >Efficient detection and size determination of crystal originated 'particles' (COPs) on silicon wafer surface using optical scattering technique integrated to an atomic force microscope
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Efficient detection and size determination of crystal originated 'particles' (COPs) on silicon wafer surface using optical scattering technique integrated to an atomic force microscope

机译:使用集成到原子力显微镜的光散射技术有效检测和确定硅晶片表面上晶体起源的“粒子”(COP)的大小

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摘要

Dark-field optical scattering technique is adopted in a surface defect detection system (DDS) to allow an efficient and cost-effective detection and size determination of the crystal originated "particles" (COPs) on polished silicon wafer surface before atomic force microscope (AFM) measurement. The effects of laser beam power, beam angle, beam profile, wafer rotation and intensified CCD (ICCD) camera exposure time on the scattered light diameter of preselected COPs were investigated. An AFM was integrated to the DDS through coordinate linkage to confirm the diagonal length, shape and type of the COPs detected. A correlation curve between the scattered light diameters and the actual diagonal lengths of the COPs was then obtained. Once the correlation is established, the size of COP on any wafer surface can be estimated simply by referring to the correlation curve without constant reference to the AFM. In this study, the detection of a single-type COP with a diagonal length of 60 nm was demonstrated.
机译:表面缺陷检测系统(DDS)中采用了暗场光学散射技术,可以在原子力显微镜(AFM)之前对抛光的硅晶片表面上的晶体“颗粒”(COP)进行高效且经济高效的检测和尺寸确定) 测量。研究了激光功率,光束角度,光束轮廓,晶片旋转和增强CCD(ICCD)相机曝光时间对预选COP散射光直径的影响。通过坐标联动将AFM集成到DDS中,以确认检测到的COP的对角线长度,形状和类型。然后获得了散射光直径和COP的实际对角线长度之间的相关曲线。一旦建立了相关性,就可以简单地通过参考相关曲线来估算任何晶片表面上COP的大小,而无需不断参考AFM。在这项研究中,证明了对角线长度为60 nm的单一类型COP的检测。

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