首页> 外文期刊>IEEE Transactions on Semiconductor Manufacturing >Factory Throughput Improvements Through Intelligent Integrated Delivery in Semiconductor Fabrication Facilities
【24h】

Factory Throughput Improvements Through Intelligent Integrated Delivery in Semiconductor Fabrication Facilities

机译:通过在半导体制造设施中进行智能集成交付来提高工厂吞吐量

获取原文
获取原文并翻译 | 示例
           

摘要

"Integrated Delivery" is a system that integrates the automated material handling systems (AMHSs) with process tools to automate the flow of material through a semiconductor fabrication facility (fab). It was developed to streamline operations in fully mechanized 300-mm wafer fabs by automating the delivery of lots to/from the tools, and automating all aspects of lot processing, with no manual intervention. Within this context, lot delivery performance is a critical factor impacting factory throughput. Poor material delivery performance translates into tools sitting idle waiting for lots to be delivered, which increases tool cycle time and decreases output. This paper describes intelligent integrated delivery (IID) capabilities, including just-in-time proactive material movement and delivery prioritization, to reduce delivery time impacts. These capabilities significantly reduce the lot delivery queue time, and as a result, measurably improve factory throughput. The results have been demonstrated via theoretical modeling, as well through actual deployment in Intel's 300 mm fabs.
机译:“集成交付”是将自动化材料处理系统(AMHS)与处理工具集成在一起的系统,以使通过半导体制造设施(fab)的材料流自动化。它的开发旨在通过自动化到/来自工具的批量交付以及自动化批量处理的各个方面而无需人工干预,来简化全机械化300毫米晶圆厂的操作。在这种情况下,批量交付性能是影响工厂吞吐量的关键因素。较差的物料输送性能会导致刀具闲置等待交付大量工件,这增加了刀具循环时间并降低了产量。本文介绍了智能集成交付(IID)功能,包括及时的主动物料移动和交付优先级,以减少交付时间的影响。这些功能显着减少了批次交付队列的时间,结果可观地提高了工厂的吞吐量。结果已通过理论建模以及在英特尔300毫米晶圆厂的实际部署得到了证明。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号