FABRICATION FACILITY FOR THE PRODUCTION OF INTEGRATED CIRCUITS FROM SEMICONDUCTOR-WAFERS AND WAFFLE ELEMENT FOR A FABRICATION FACILITY

摘要

The present invention relates to a system for forming an integrated circuit on a semiconductor wafer. The system according to the present invention has at least one radiation generator for generating EUV radiation. The EUV radiation is supplied to at least one lithography device for the exposure of a wafer. The lithography device is installed in a building for fabrication. The radiation generator is provided in a building separated from the building for fabrication or a part thereof. The EUV radiation is supplied to the building for fabrication through at least one radiation guiding section. At least one supplying pipe is branched from the radiation guiding section at an obtuse angle and at least part of the EUV radiation is supplied to the lithography device through the supplying pipe. A waffle member has a rectangular shape and at least one path forming an acute angle with the central surface of the waffle member when viewed from the above. The system and the waffle member allow cost-efficient and simple supply of the EUV radiation to the lithography device.