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Due-Date Assignment for Wafer Fabrication Under Demand Variate Environment

机译:需求变化环境下晶圆制造的截止日期分配

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摘要

In the semiconductor industry, dynamic changes in demand force companies to change the product mix frequently and periodically. Assigning tight but attainable due dates is a great challenge under the circumstances that the product mix changes periodically. In this paper, we consider the due-date assignment problem for wafer fabrication and present a due-date assignment model to set manufacturing due dates satisfying the target on-time-delivery rate. The contamination model is applied to tackle the effect of that product mix varies periodically. We demonstrate the effectiveness and accuracy of the proposed model by solving a real-world example taken from a wafer fabrication shop floor in an IC manufacturing factory
机译:在半导体行业,需求的动态变化迫使公司频繁且定期地更改产品组合。在产品组合定期更改的情况下,分配紧要但可以达到的到期日期是一个巨大的挑战。在本文中,我们考虑了晶圆制造的交货期分配问题,并提出了交货期分配模型来设置满足目标准时交货率的生产交货期。应用污染模型来解决产品组合定期变化的影响。我们通过解决一个来自IC制造工厂的晶圆制造车间的实际示例,来证明所提出模型的有效性和准确性。

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