Physical Analysis of Stress Testing for Failure of Electronic Components

摘要

Starting with an assumption concerning the type of physical process causing failure and an assumption concerning the random distribution of components with respect to a failure threshold. cumulative distribution functions in time, temperature, and voltage are derived. These cumulative distribution functions are identical to each other if the random variables are certain functions of time, temperature, or voltage, thus showing the equivalence of time, temperature, and voltage as stresses. The cumulative distribution function in time is the familiar log-normal function. If it is known that the assumed physical process is the only one causing failure, then one can rigorously replace time by temperature or voltage. However, it is demonstrated that in an accelerated test, i.e., one in which time is replaced by another stress such as temperature, one can never be sure that another process will not be predominant at longer times; thus, one can never make a certain extrapolation to longer times. One might be able to circumvent this difficulty by having a thorough knowledge of the physics, chemistry, and metallurgy of the possible failure processes in the component.