Analysis of electronic component failures using high-density radiography

摘要

The exceptional resolution and nondestructive nature of microfocus radiography has proven to be extremely useful in the diagnosis of electronic component failures, particularly when the components are contained in sealed or encapsulated assemblies. An epoxy-encapsulated NTC thermistor and an epitaxial silicon P-N junction photodetector are examples of discrete devices in which the cause of failure was correctly hypothesized directly from a radiographic image. Subsequent destructive physical examinations confirmed the initial hypothesis and established the underlying cause in each case. The problem in a vacuum switch tube which failed to function was apparent in the radiographic image, but the underlying cause was not clear. However, radiography also showed that the position of a flat cable in the assembly could contribute to failure, an observation which resulted in a change in manufacturing procedure. In each of these instances, microradiography played a key role in decisions concerning the root cause of failure, product viability, and corrective action. 15 refs., 10 figs.