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首页> 外文期刊>IEEE Transactions on Nuclear Science >Simulation study of single-event gate rupture using radiation-hardened stripe cell power MOSFET structures
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Simulation study of single-event gate rupture using radiation-hardened stripe cell power MOSFET structures

机译:使用辐射硬化的条纹电池功率MOSFET结构进行单事件门破裂的仿真研究

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摘要

A two-dimension simulation study of single-event gate rupture (SEGR) in radiation-hardened stripe cell power MOSFETs is reported. Simulations are performed on stripe-cell structures employing three different neck widths. A simple methodology is presented showing how these simulations can be used to approximate the drain and gate biases required to induce SEGR. These biases are then compared with the experimental data and found to be in good agreement. By means of simulations, we investigated the effects of various physical mechanisms and input parameters, which are likely to be important in SEGR and found that impact ionization plays a crucial role in the process. The simulations show that the N+ source and P+ plug are critical to the hardened design (narrower neck widths). Clearly, simulations could become a useful tool in evaluating certain design and processing variations.
机译:报道了辐射硬化的条纹电池功率MOSFET中单事件栅极破裂(SEGR)的二维仿真研究。对采用三种不同颈宽的条纹单元结构进行了仿真。提出了一种简单的方法,该方法显示了如何使用这些模拟来近似诱导SEGR所需的漏极和栅极偏置。然后将这些偏差与实验数据进行比较,发现它们之间具有很好的一致性。通过模拟,我们研究了各种物理机制和输入参数的影响,这些影响可能在SEGR中很重要,并且发现碰撞电离在该过程中起着至关重要的作用。仿真表明,N +源和P +插头对于硬化设计(窄的颈部宽度)至关重要。显然,仿真可以成为评估某些设计和工艺变化的有用工具。

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