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首页> 外文期刊>IEEE Transactions on Nuclear Science >Effects of particle energy on proton-induced single-event latchup
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Effects of particle energy on proton-induced single-event latchup

机译:粒子能量对质子诱导的单事件闩锁的影响

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摘要

The effect of proton energy on single-event latchup (SEL) in present-day SRAMs is investigated over a wide range of proton energies and temperature. SRAMs from five different vendors were irradiated at proton energies from 20 to 500 MeV and at temperatures of 25/spl deg/ and 85/spl deg/C. For the SRAMs and radiation conditions examined in this work, proton energy SEL thresholds varied from as low as 20 MeV to as high as 490MeV. To gain insight into the observed effects, the heavy-ion SEL linear energy transfer (LET) thresholds of the SRAMs were measured and compared to high-energy transport calculations of proton interactions with different materials. For some SRAMs that showed proton-induced SEL, the heavy-ion SEL threshold LET was as high as 25MeV-cm/sup 2//mg. Proton interactions with Si cannot generate nuclear recoils with LETs this large. Our nuclear scattering calculations suggest that the nuclear recoils are generated by proton interactions with tungsten. Tungsten plugs are commonly used in most high-density ICs fabricated today, including SRAMs. These results demonstrate that for system applications where latchups cannot be tolerated, SEL hardness assurance testing should be performed at a proton energy at least as high as the highest proton energy present in the system environment. Moreover, the best procedure to ensure that ICs will be latchup free in proton environments may be to use a heavy-ion source with LETs /spl ges/40 MeV-cm/sup 2//mg.
机译:在广泛的质子能量和温度范围内研究了质子能量对当今SRAM中单事件闩锁(SEL)的影响。来自5个不同供应商的SRAM以20至500 MeV的质子能量以及25 / spl deg /和85 / spl deg / C的温度辐照。对于这项工作中检查的SRAM和辐射条件,质子能量SEL阈值从低至20 MeV到高至490MeV不等。为了深入了解所观察到的效果,测量了SRAM的重离子SEL线性能量转移(LET)阈值,并将其与质子与不同材料相互作用的高能输运计算进行了比较。对于某些显示质子诱导的SEL的SRAM,重离子SEL阈值LET高达25MeV-cm / sup 2 // mg。如此大的LET,质子与Si的相互作用不能产生核反冲。我们的核散射计算表明,核后坐力是由质子与钨相互作用产生的。钨插头通常用于当今制造的大多数高密度IC中,包括SRAM。这些结果表明,对于不能容忍闩锁的系统应用,应该在质子能量至少与系统环境中存在的最高质子能量一样高的质子能量下执行SEL硬度保证测试。此外,确保IC在质子环境中不会发生闩锁的最佳方法可能是使用重离子源(LETs / spl ges / 40 MeV-cm / sup 2 // mg)。

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