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Numerical simulation of GaAs MESFETs with a p-buffer layer on a semi-insulating substrate compensated by deep traps

机译:具有深陷阱补偿的半绝缘衬底上具有p缓冲层的GaAs MESFET的数值模拟

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A numerical analysis of GaAs MESFETs with a p-buffer layer on a semi-insulating substrate is performed in which impurity compensation by traps in the substrate is considered. It is shown that the use of a thick p-buffer layer results in a lower device current due to the formation of a steep barrier at the channel-substrate interface. It is also shown that with higher trap and acceptor densities in the substrate, the drain current is reduced due to the decrease in the substrate current. This decrease occurs because a negative-space-charge layer is formed in the substrate. It is demonstrated that when the p-buffer layer is fully depleted, its acceptors play the same electrical role as the acceptors within the space-charge region of the semi-insulating substrate. Thus, using a thick p-buffer layer has the same effect as using a substrate with a high density of traps, i.e. it minimizes the short-channel effects in GaAs MESFETs. Therefore, if the trap density in the substrate is low, the short-channel effects can be reduced by introducing a p-buffer layer or a buried p-layer.
机译:对半绝缘衬底上具有p缓冲层的GaAs MESFET进行了数值分析,其中考虑了衬底中陷阱引起的杂质补偿。已经表明,由于在沟道-衬底界面处形成陡峭的势垒,使用厚的p-缓冲层导致较低的器件电流。还显示出在衬底中具有较高的陷阱和受体密度时,由于衬底电流的减小而减小了漏极电流。因为在基板中形成了负空间电荷层,所以发生该减少。已经证明,当p-缓冲层完全耗尽时,其受体与半绝缘衬底的空间电荷区域内的受体起着相同的电作用。因此,使用厚的p缓冲层具有与使用具有高陷阱密度的衬底相同的效果,即,它使GaAs MESFET中的短沟道效应最小化。因此,如果衬底中的陷阱密度低,则可以通过引入p缓冲层或掩埋p层来减小短沟道效应。

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