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Comparison of the 'Pad-Open-Short' and 'Open-Short-Load' Deembedding Techniques for Accurate On-Wafer RF Characterization of High-Quality Passives

机译:“ Pad-Open-Short”和“ Open-Short-Load”去嵌入技术的比较,这些技术可对高质量无源器件进行准确的晶片上RF表征

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摘要

The impedance errors remaining after applying the industry standard "open-short," a "pad-open-short," and a "open-short-load" deembedding scheme on a 0.43-nH 20-GHz high-Q single-loop inductor test structure are investigated using real S-parameter data taken up to 50 GHz. Since the latter two deembedding schemes both correct for all parasitic elements of the test structures, they are, at least in principle, error free. The accuracy of the "open-short-load" deembedding scheme, however, critically depends on how well the reactive part of the load resistance is accounted for. This issue makes the more simple "pad-open-short" deembedding scheme an attractive choice because the required split between external and internal capacitances is easy to make, either based on process and layout information or from measurements done on a "pad" dummy structure.
机译:在0.43 nH 20 GHz高Q单回路电感器上应用行业标准“开路-短路”,“焊盘-开路-短路”和“开路-短路-负载”去嵌入方案后,仍然存在阻抗误差使用高达50 GHz的真实S参数数据对测试结构进行了研究。由于后两种去嵌入方案都可以针对测试结构的所有寄生元素进行校正,因此,至少在原则上它们没有错误。但是,“空载-短负荷”去嵌入方案的精度主要取决于负载电阻的电抗部分的计算能力。这个问题使更简单的“焊盘-开-短路”去嵌入方案成为一个有吸引力的选择,因为根据工艺和布局信息或在“焊盘”虚拟结构上进行的测量,很容易在外部和内部电容之间进行所需的分割。

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