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Ground-Shielded Measuring Technique for Accurate On-Wafer Characterization of RF CMOS Devices

机译：接地屏蔽测量技术，用于RF CMOS器件的晶圆上准确表征

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Troels Emil Kolding; Ole Kiel Jensen; Torben Larsen;
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年度 2000
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1. THRU-Based Cascade De-embedding Technique for On-Wafer Characterization of RF CMOS Devices [J] . Loo, X.S., Yeo, IEEE Transactions on Electron Devices . 2013,第9期

机译：基于THRU的级联去嵌入技术用于RF CMOS器件的晶圆上表征
2. Comparison of the "Pad-Open-Short" and "Open-Short-Load" Deembedding Techniques for Accurate On-Wafer RF Characterization of High-Quality Passives [J] . Luuk F. Tiemeijer, Ramon J. Havens, Andre B. M. Jansman, IEEE Transactions on Microwave Theory and Techniques . 2005,第2期

机译：“ Pad-Open-Short”和“ Open-Short-Load”去嵌入技术的比较，这些技术可对高质量无源器件进行准确的晶片上RF表征
3. A Technique to Reduce On-Wafer Measurement Uncertainty for CMOS Transmission Line Characterization [J] . Assuncao Mario, Mendonca dos Santos P., Freire Joao Costa Microwave and Wireless Components Letters, IEEE . 2015,第12期

机译：减少CMOS传输线表征晶圆上测量不确定度的技术
4. Ground-shielded measuring technique for accurate on-wafer characterization of RF CMOS devices [C] . Kolding, T.E., Jensen, . 2000

机译：接地屏蔽测量技术，可准确表征RF CMOS器件的晶圆上特性
5. Bipolar device characterization and design in CMOS technologies for the design of high-performance low-cost BiCMOS analog integrated circuits [D] . Larsen, Frode. 1994

机译：CMOS技术中的双极性器件表征和设计，用于设计高性能低成本BiCMOS模拟集成电路
6. Beyond CMOS: heterogeneous integration of III–V devices RF MEMS and other dissimilar materials/devices with Si CMOS to create intelligent microsystems [O] . Thomas E. Kazior -1

机译：超越CMOS：III-V器件RF MEMS和其他异种材料/器件与Si CMOS的异构集成以创建智能微系统
7. Measurement and Deembedding Technique for the on-wafer Characterization of Multiport Devices [O] . Audrey Cayron, Christophe Viallon, Ayad Ghannam, 2020

机译：多端口器件晶圆表征的测量和解除技术

Ground-Shielded Measuring Technique for Accurate On-Wafer Characterization of RF CMOS Devices

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