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首页> 外文期刊>Microwave Theory and Techniques, IEEE Transactions on > src='/images/tex/228.gif' alt='Q'> -Band Spatially Combined Power Amplifier Arrays in 45-nm CMOS SOI
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src='/images/tex/228.gif' alt='Q'> -Band Spatially Combined Power Amplifier Arrays in 45-nm CMOS SOI

机译: src =“ / images / tex / 228.gif” alt =“ Q”> -45 nm CMOS SOI中的波段空间组合功率放大器阵列

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This paper reports 45-GHz power amplifier (PA) arrays implemented in 45-nm CMOS silicon-on-insulator, coupled to antenna arrays to enable free-space power combining. A single CMOS chip (2.54.5 ) containing eight-unit PAs was developed and its output was fed to a 22 array of differentially fed patch antennas on a printed circuit board. This array provided an equivalent isotropic radiated power (EIRP) of 40 dBm at 45 GHz with 28 dBm of total RF power generated by the chip. A larger array, composed of four CMOS chips and feeding a 28 array of antennas, was shown to deliver an EIRP of 50 dBm at 45 GHz, while generating a total RF power of 33 dBm together with an antenna array gain of 17 dB. The dc power consumptions for the and the 28 arrays were 4.9 and 18 W, respectively, with estimated peak power-added efficiencies of 13.5% and 10.7%.
机译:本文报告了在45纳米CMOS绝缘体上硅上实现的45 GHz功率放大器(PA)阵列,该阵列与天线阵列耦合以实现自由空间功率合并。开发了包含八个单元PA的单个CMOS芯片(2.54.5),并将其输出馈送到印刷电路板上的22个差分馈入的贴片天线阵列。该阵列在45 GHz时提供40 dBm的等效全向辐射功率(EIRP),芯片产生的总RF功率为28 dBm。较大的阵列由四个CMOS芯片组成,并为28个天线阵列供电,在45 GHz时可提供50 dBm的EIRP,同时产生33 dBm的总RF功率以及17 dB的天线阵列增益。和28个阵列的直流功耗分别为4.9和18 W,估计的峰值附加功率效率为13.5%和10.7%。

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