Microwave Acoustic Wave Devices: Recent Advances on Architectures, Modeling, Materials, and Packaging

摘要

This paper reviews applications of acoustic wave devices in mobile communication. After a general and historical introduction to bulk acoustic wave (BAW) and surface acoustic wave (SAW) devices, a review is given on the architectures where acoustic wave devices are applied driving the requirements on the SAW and BAW components. Following this, we discuss the progress in technology important materials. Next, an overview on the modeling and characterization of SAW and BAW at high power levels is given. Finally an overview of packaging technologies and an outlook to future developments is provided. Finally, an outlook to future developments is provided.