The effect of various process parameters on the magnetic properties of sputter deposited Co/Pd multilayered films is presented. The coercivity of the films was found to increase logarithmically with the thickness of the Pd underlayer. Various combinations of sputter gas (Ar) pressure during the deposition of the underlayer (P/sub ul/) and during the deposition of the multilayer (P/sub ml/) were studied. Coercivity was found to depend on both P/sub ul/ and P/sub ml/. When P/sub ml/ was kept constant at 3 mTorr, a decrease in coercivity with the increase in P/sub ul/ was observed. And, for a constant P/sub ul/ of 3 mTorr, an increase in coercivity was observed when P/sub ml/ was increased. The magnetization reversal mechanism of these films was found to change from domain wall motion to rotation when P/sub ul/ is increased from 3 mTorr to 18 mTorr or higher. However, the change in the reversal mechanism was not observed with the variation in the preparation conditions of the magnetic layer or the other underlayer process parameters such as the thickness or sputter power.
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机译：提出了各种工艺参数对溅射沉积Co / Pd多层膜的磁性能的影响。发现膜的矫顽力随Pd底层的厚度对数增加。研究了在底层沉积期间（P / sub ul /）和多层沉积期间（P / sub ml /）的溅射气体（Ar）压力的各种组合。发现矫顽力取决于P / sub ul /和P / sub ml /。当P / sub ml /保持恒定在3 mTorr时，矫顽力随P / sub ul /的增加而降低。并且，对于恒定的P / sub ul /为3 mTorr，当P / sub ml /增大时，矫顽力会增加。当P / sub ul /从3 mTorr增加到18 mTorr或更高时，发现这些薄膜的磁化反转机理从畴壁运动变为旋转。然而，在磁性层的制备条件或诸如厚度或溅射功率之类的其他底层工艺参数的变化中，未观察到反转机理的变化。
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