Crystallographic Texture and Whiskers in Electrodeposited Tin Films

摘要

Electron back scatter diffraction (EBSD) analysis was used to determine texture for electrodeposited tin films, and the results were compared to standard X-ray "times random" and full pole figure texture analysis. The data showed that EBSD and X-ray texture results differed as to primary and secondary texture determinations with some degree of correlation between texture determinations when primary/secondary/tertiary calculations were disregarded. It is these authors' opinion that film texture cannot be accurately determined using "times random" X-ray diffraction (XRD) techniques, and that there is considerable room for error with X-ray pole figure analyses. These data must be considered preliminary due to the small sample size, but these results indicate that electroplaters may have better control over as-deposited tin film texture than is currently believed, and that there is a relationship between as-deposited texture and film stress