机译:应力和电迁移对三维集成电路微凸点微结构演变的影响
Sch. of Phys. & Eng., Sun Yat-sen Univ., Guangzhou, China;
chemical interdiffusion; copper compounds; electromigration; shear modulus; three-dimensional integrated circuits; tin; 3D IC; Cusub3/subSn; Sn-Cusub6/subSnsub5/sub; anisotropic microstructures; cathode; electromigration; external compressive stress; external shear; heterogeneous microstructures; interdiffusion; interdiffusion flux; interfacial grains; microbumps; microstructural evolution; phase field model; preferential growth; shear modulus; stress management; temperature 150 degC; three-dimensional integrated circuits; through-silicon vias; Compressive stress; Mathematical model; Microstructure; Tensile stress; Three-dimensional displays; Tin; Electromigration; interconnections; modeling; stress; tin compounds;
机译:三维集成电路集成中由于18μm微型凸块的电迁移导致的快速相变
机译:三维集成电路封装中无铅微凸块的电迁移行为评估
机译:用于三维集成电路的Ni / Sn-2.5Ag / Ni微凸点中金属间化合物的演变
机译:三维集成电路中Cu / Ni / Sn-Ag微凸块的电迁移极性效应
机译:高频三维集成电路的玻璃微凸点结合方法。
机译:三维集成中多尺度微结构和微结构对微凸块可靠性的影响
机译:应力和电迁移对三维集成电路微凸点微观结构演变的影响
机译:具有线宽的铝电迁移寿命变化:应力条件变化的影响(集成电路的金属化)