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SET Response of the Selectively Implanted Deep N-Well —Comparison With Dual Well and Triple Well

机译:选择性注入的深N阱的SET响应-双阱和三阱的比较

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The SET response of the selectively implanted deep N-well (SIDNW) was compared with dual well (DW) and triple well (TW) structures by way of heavy-ion experiments on a 65-nm bulk CMOS process. Experimental data produced by P-hit target chains with SIDNW show that a 34.2% decrease in the average pulse width and a 32.1% decrease in the SET cross section is achieved when compared with the DW process, demonstrating the effectiveness of SIDNW in mitigating PMOS SETs by reducing the parasitic bipolar effect during charge collection. Heavy-ion test results on inverter chains, in which the SETs are generated in both PMOS and NMOS, indicate that the SIDNW can mitigate PMOS SETs without bringing adverse effects to the NMOS SETs, when compared with the DW and TW processes.
机译:通过在65纳米体CMOS工艺上进行重离子实验,将选择性注入的深N阱(SIDNW)的SET响应与双阱(DW)和三阱(TW)结构进行了比较。由P-命中目标链与SIDNW产生的实验数据表明,与DW工艺相比,平均脉冲宽度减少了34.2%,SET横截面减少了32.1%,证明了SIDNW在缓解PMOS SET方面的有效性通过减少电荷收集过程中的寄生双极效应。在逆变器链上的重离子测试结果表明,与DW和TW工艺相比,SIDNW可以减轻PMOS SET的影响,而不会对NMOS SET产生不利影响,在逆变器链中,SET分别在PMOS和NMOS中生成。

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