Guest Editorial IEEE International Integrated Reliability Workshop (IIRW) 2019

摘要

The IEEE International Integrated Reliability Workshop (IIRW) is a unique event that takes place every year at the beautiful Fallen Leaf Lake, in Tahoe, California. This workshop brings together reliability engineers and researchers from around the world, to exchange ideas over four days in a relaxed, friendly, and informal atmosphere. The workshop focuses on the recent advances in research concerning semiconductor device reliability and its different challenges. Topics include front-end-of-line reliability issues (bias temperature instability, hot-carrier degradation, time dependent dielectric breakdown), back-end-of-line/middle-of-line degradation effects (electromigration, stress migration, time dependent dielectric breakdown) as well as memory reliability, chip to package interaction, degradation effects in wide-bandgap-materials and high-voltage devices, and many others.