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LUTSim: A Look-Up Table-Based Thermal Simulator for 3-D ICs

机译:LUTSim:用于3D IC的基于查找表的热仿真器

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摘要

To sustain Moore’s law, three-dimensional integrated circuit (3-D IC) is a promising solution to achieve high performance and low cost targets. However, its operating temperature is higher than that of a 2-D IC because of its high power density of stacked dies and ill of heat dissipation capability. Therefore, on-chip thermal effects have become major concerns of 3-D ICs. Utilizing look-up table approach, this paper, LUTSim, provides two thermal simulation engines, I-LUTSim and S-LUTSim, to efficiently calculate the thermal profile of a 3-D IC. I-LUTSim is suitable for full-chip thermal analysis, and S-LUTSim is suited for incremental-thermal updating. With utilizing the prebuilt tables, compared with a commercial tool ANSYS, the absolute error of I-LUTSim is less than 0.29%. Moreover, with negligible loss of accuracy, I-LUTSim can be 38.8 times faster than a well-known matrix solver SuperLU for performing full-chip thermal simulation. Besides, S-LUTSim can be over 1.05 million times faster than SuperLU for adjusting the thermal profile after inserting/removing a through silicon via.
机译:为了维持摩尔定律,三维集成电路(3-D IC)是实现高性能和低成本目标的有希望的解决方案。但是,由于其堆叠芯片的高功率密度和散热能力不良,其工作温度高于2-D IC。因此,片上热效应已成为3-D IC的主要关注点。利用查找表方法,本文LUTSim提供了两个热仿真引擎I-LUTSim和S-LUTSim,以有效地计算3-D IC的热分布。 I-LUTSim适用于全芯片热分析,而S-LUTSim适用于增量热更新。与商用工具ANSYS相比,利用预建的表格,I-LUTSim的绝对误差小于0.29%。此外,由于I-LUTSim的精度损失可忽略不计,因此它可以比进行全芯片热仿真的著名矩阵求解器SuperLU快38.8倍。此外,在插入/移除硅通孔之后,S-LUTSim可以比SuperLU快105万倍,以调节热分布。

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