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Automated Selection of Assertions for Bit-Flip Detection During Post-Silicon Validation

机译:硅后验证期间用于位翻转检测的断言的自动选择

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摘要

Post-silicon validation deals with detection and diagnosis of errors that, due to existing limitations in pre-silicon verification, escape to the silicon prototypes and need to be fixed before committing to high-volume manufacturing. Electrical errors, such as those caused by cross-talk or power droops, are particularly difficult to catch during the pre-silicon phase because of the insufficient accuracy of device models, which is often traded-off against simulation time. This challenge is further aggravated by the rising number of voltage domains, especially if subtle errors are excited in unique electrical states. In fact these electrically-induced subtle errors most commonly manifest in the logic domain as bit-flips and, to the best of our knowledge, there are no systematic methods for designing embedded hardware monitors for generic logic blocks that can detect bit-flips with low detection latency. Moreover, unlike pre-silicon verification and manufacturing test that benefit from well-defined and universally accepted coverage metrics, there is no generic metric from which confidence can be implied at the end of post-silicon validation. Toward these goals, we present a method that relies on design invariants (assertions) that are ranked based on their potential to detect bit-flips. We also introduce two metrics bit-flip coverage estimate and flip-flop coverage estimate that can be used to assess the quality of the selected assertions, and, in general, the effectiveness of the post-silicon validation process.
机译:硅后验证处理错误的检测和诊断,这些错误由于硅前验证中的现有限制而无法进入硅原型,因此需要进行批量生产之前进行修复。由于器件模型的精度不足,因此在硅前阶段就很难捕获诸如串扰或功率下降引起的电气错误,这通常很难与仿真时间进行权衡。越来越多的电压域进一步加剧了这一挑战,特别是如果在独特的电气状态下激发出细微的误差时。实际上,这些由电引起的细微错误通常在逻辑域中以位翻转的形式表现出来,据我们所知,没有系统的方法可以为通用逻辑模块设计嵌入式硬件监视器,从而可以检测低位翻转检测延迟。此外,与得益于定义完善且普遍接受的覆盖率指标的硅前验证和制造测试不同,没有通用的指标可以在硅后验证结束时暗示置信度。为了实现这些目标,我们提出了一种方法,该方法依赖于根据其检测位翻转的潜力进行排名的设计不变式(断言)。我们还介绍了两个指标位翻转覆盖率估计值和触发器覆盖率估计值,可用于评估所选断言的质量,以及总体而言,评估硅后验证过程的有效性。

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