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首页> 外文期刊>IEEE transactions on circuits and systems . I , Regular papers >Fully-Integrated Charge Pump Design Optimization for Above-Breakdown Biasing of Single-Photon Avalanche Diodes in 0.13- $mu$ m CMOS
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Fully-Integrated Charge Pump Design Optimization for Above-Breakdown Biasing of Single-Photon Avalanche Diodes in 0.13- $mu$ m CMOS

机译:以0.13- $ mu $ <的单光子雪崩二极管的击穿偏置的完全集成电荷泵设计优化。 / inline-formula> m CMOS

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摘要

A design methodology for an area-optimized integrated charge pump is described suitable for on-chip high-voltage reverse bias of single-photon avalanche diodes (SPADs). The high-voltage generation block is implemented in a general-purpose 0.13-mu m CMOS process and is capable of generating a maximum regulated output voltage of 17.7 V from an input of 1.8 V. An ON-OFF regulation scheme with dynamic charging and discharging capability of the charge pump provides fast recovery of the output bias voltage during SPAD transients, where overshoot and undershoot must both be corrected during active quench and reset. Following a SPAD avalanche current pulse, the measured transient recovery time is 500 ns from a 150-mV overshoot and a 500-mV undershoot to reach 99% of steady-state output. The implemented SPAD bias generation system occupies 0.175-mm(2) chip area, without requiring an off-chip load capacitor.
机译:描述了一种适用于面积优化的集成电荷泵的设计方法,适用于单光子雪崩二极管(SPAD)的片上高压反向偏置。高压生成模块采用通用的0.13μmCMOS工艺实现,能够从1.8 V的输入产生最大17.7 V的调节输出电压。具有动态充电和放电功能的ON-OFF调节方案电荷泵的功能可以在SPAD瞬态期间快速恢复输出偏置电压,在瞬态过冲和下冲都必须在主动失超和复位期间都进行校正。在SPAD雪崩电流脉冲之后,从150 mV过冲和500 mV下冲到达到99%稳态输出的实测瞬态恢复时间为500 ns。已实现的SPAD偏置生成系统占用0.175 mm(2)的芯片面积,而无需片外负载电容器。

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