首页> 外文期刊>Photonics Technology Letters, IEEE >1.3- m In(Ga)As Quantum-Dot VCSELs Fabricated by Dielectric-Free Approach With Surface-Relief Process
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1.3- m In(Ga)As Quantum-Dot VCSELs Fabricated by Dielectric-Free Approach With Surface-Relief Process

机译:无电介质表面浮雕工艺制备的1.3 m In(Ga)As量子点VCSEL

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We present the 1.3-$mu$ m In(Ga)As quantum-dot (QD) vertical-cavity surface-emitting lasers (VCSELs) fabricated by the dielectric-free (DF) approach with the surface-relief (SR) process. Compared with the conventional dielectric-dependent (DD) method, the lower differential resistance and improved output power have been achieved by the DF approach. With the same oxide aperture area, the differential resistance is reduced by 36.47% and output power is improved by 78.32% under continuous-wave operation; it is up to 3.42 mW under pulsed operation with oxide aperture diameter $sim$15 $mu$m. The surface-relief technique is also applied, for the first time, in 1.3- $mu$m QD VCSELs, and it effectively enhances the emission of the fundamental mode. The characteristic of small signal modulation response is also analyzed.
机译:我们介绍了通过无电介质(DF)方法和表面浮雕(SR)工艺制造的1.3μmIn(Ga)As量子点(QD)垂直腔面发射激光器(VCSEL)。与传统的介电相关(DD)方法相比,DF方法已实现了更低的差分电阻和更高的输出功率。在相同的氧化物孔径面积下,连续波工作时,差动电阻降低了36.47%,输出功率提高了78.32%。在脉冲操作下,氧化物孔径直径为$ sim $ 15 $ mu $ m时,功率高达3.42 mW。表面浮雕技术也首次在1.3μm的QD VCSEL中应用,它有效地增强了基模的发射。还分析了小信号调制响应的特性。

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