首页> 外文期刊>Fusion Science and Technology >FABRICATION OF TUNGSTEN-VANADIUM HYBRID MATERIAL WITH SUFFICIENT TOUGHNESS FOR HIGH-TEMPERATURE APPLICATIONS BY DIFFUSION BONDING
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FABRICATION OF TUNGSTEN-VANADIUM HYBRID MATERIAL WITH SUFFICIENT TOUGHNESS FOR HIGH-TEMPERATURE APPLICATIONS BY DIFFUSION BONDING

机译:扩散结合法制备具有足够韧性的钨钒混合材料

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摘要

The design of fusion plasma-facing components is challenging, as their materials have to meet rigorous requirements in terms of low activation and high-temperature strength. At the same time, sufficient ductility is required even in the low-temperature range. Unfortunately, these properties are not found in conventional materials. To solve this problem, a hybrid material that combines the high strength of one material with the high ductility of the other material was developed. This paper presents the hybrid material, which consists of thin tungsten and vanadium layers. This hybrid material was produced by means of diffusion bonding at relatively low temperature in a vacuum chamber. Microstructural investigations and nanoindentation tests indicated no cracks, no delamination, and no brittle intermetallic phases along the bond interfaces. Investigations of the mechanical properties of the hybrid material by instrumented Charpy impact tests revealed a relatively low ductile-to-brittle transition temperature (DBTT) at 124℃ (compared to the DBTT of polycrystalline tungsten of >441℃) with an absorbed Charpy impact energy of 4.53 J [kleinst (KLST)-specimen]. Additionally, the tested Charpy impact specimens were found to be not fractured thoroughly even at room temperature.
机译:面向熔融等离子体的组件的设计具有挑战性,因为它们的材料必须在低活化和高温强度方面满足严格的要求。同时,即使在低温范围内也需要足够的延展性。不幸的是,在常规材料中没有发现这些性能。为了解决该问题,开发了将一种材料的高强度与另一种材料的高延展性相结合的混合材料。本文介绍了一种混合材料,它由钨和钒的薄层组成。这种杂化材料是通过在真空室中在相对较低的温度下进行扩散结合而制成的。显微组织研究和纳米压痕测试表明,沿键合界面无裂纹,分层和金属间脆性。通过仪器化的夏比冲击试验对杂化材料的力学性能进行的研究表明,在124℃时,韧性到脆性转变温度(DBTT)较低(与大于441℃的多晶钨的DBTT相比),并且吸收了夏比冲击能4.53 J [kleinst(KLST)-标本]。另外,发现测试的夏比冲击试样甚至在室温下也没有彻底断裂。

著录项

  • 来源
    《Fusion Science and Technology》 |2014年第2期|315-321|共7页
  • 作者单位

    Karlsruhe Institute of Technology, Institute for Applied Materials, Hermann-von-Helmholtz-Platz 1 D-76344 Eggenstein-Leopoldshafen, Germany;

    Karlsruhe Institute of Technology, Institute for Applied Materials, Hermann-von-Helmholtz-Platz 1 D-76344 Eggenstein-Leopoldshafen, Germany;

    Karlsruhe Institute of Technology, Institute for Applied Computer Science/Automation Technology Hermann-von-Helmholtz-Platz 1, D-76344 Eggenstein-Leopoldshafen, Germany;

    Karlsruhe Institute of Technology, Institute for Applied Materials, Hermann-von-Helmholtz-Platz 1 D-76344 Eggenstein-Leopoldshafen, Germany;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    tungsten; vanadium; diffusion bonding;

    机译:钨钒;扩散键;

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