Micromachined silicon housings cut size and cost for optical transceiver subassemblies

摘要

Improvements in silicon micro-electromechanical system (mems) technology, wafer level assembly and test enable both the reduction of current packaging costs and reductions in size. This will create valuable bandwidth for new applications, particularly for optical communications. Hymite believes that the silicon platform holds the promise of significant advances in transceiver assembly automation that can increase first pass yield, decrease costs and offer multiple benefits for high-volume, inexpensive applications in data communications within the telecommunications sector