...
首页> 外文期刊>European Semiconductor >SEMI: Flat Fab equipment in 2013 to rocket 24% in 2014
【24h】

SEMI: Flat Fab equipment in 2013 to rocket 24% in 2014

机译:SEMI:2013年的平板工厂设备将在2014年猛增24%

获取原文
获取原文并翻译 | 示例
           

摘要

Fab equipment spending for Front End facilities is expected to hover around flat in 2013 and with an increase of 24 percent in 2014 as shown in Table 1 below. The SEMI World Fab Forecast, published at the end of February, reveals little has changed from the projections published at the end of November when the report was last issued. The report tracks equipment spending at over 180 facilities in 2013. At the time of the November 2012 publication, semiconductor companies had not announced their capex plans for 2013, so fab spending predictions were based on extensive modelling. More than 262 updates have been made since the last publication and are based on announced spending plans, including major changes for TSMC, Samsung, Intel, SK Hynix, Globalfoundries, UMC, and for some Japanese facilities and LED facilities.
机译:如以下表1所示,用于前端设施的Fab设备支出预计将在2013年徘徊,并在2014年增长24%。 2月底发布的SEMI世界晶圆厂预测显示,与上一次发布该报告的11月底发布的预测相比,变化不大。该报告追踪了2013年超过180家工厂的设备支出。在2012年11月发布之时,半导体公司尚未宣布其2013年的资本支出计划,因此对晶圆厂支出的预测基于广泛的建模。自上次发布以来,已经进行了262多次更新,这些更新基于已宣布的支出计划,包括对TSMC,三星,英特尔,SK Hynix,Globalfoundries,UMC的重大变更,以及对某些日本设施和LED设施的更改。

著录项

  • 来源
    《European Semiconductor》 |2013年第1期|23-23|共1页
  • 作者

  • 作者单位
  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号