Network-on-Chip Multicast Architectures Using Hybrid Wire and Surface-Wave Interconnects

摘要

The network-on-chip (NoC) has been introduced as an efficient communication backbone to tackle the increasing challenges of on-chip communication. Nevertheless, merely metal-based NoC implementation offers only limited performance and power scalability in terms of multicast and broadcast traffics. To meet scalability demands, this paper addresses the system-level challenges for intra-chip multicast communication in a proposed hybrid interconnects architecture. This hybrid NoC combines and utilizes both regular metal on-chip interconnects and new type of wireless-NoC (WiNoC) which is Zenneck surface wave interconnects (SWI). Moreover, this paper embeds novel multicast routing and arbitration schemes to address system-level multicast-challenges in the proposed architecture. Specifically, a design exploration of contention handling in SWI layer is considered in both centralized and decentralized manners. Consequently, the hybrid wire-SWI architecture avoids overloading the network, alleviates the formation of traffic hotspots and avoid deadlocks that are typically associated with state-of-the-art multicast handling. The evaluation is based on a cycle-accurate simulation and hardware description. It demonstrates the effectiveness of the proposed architecture in terms of power consumption (up to aroundn$10$nx) and performance (aroundn$22$nx) compared to regular NoCs. These results are achieved with negligible hardware overheads. This study explore promising potential of the proposed architecture for current and future NoC-based many-core processors.