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HYBRID THREE-DIMENSIONAL INTEGRATED CIRCUIT RECONFIGURABLE THERMAL AWARE AND DYNAMIC POWER GATING INTERCONNECT ARCHITECTURE
HYBRID THREE-DIMENSIONAL INTEGRATED CIRCUIT RECONFIGURABLE THERMAL AWARE AND DYNAMIC POWER GATING INTERCONNECT ARCHITECTURE
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机译:混合式三维综合电路可重构热敏组件和动态功率门互连架构
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摘要
Systems, methods, and apparatus for operating an integrated circuit (IC) are provided. An apparatus may be configured to receive at one or more switches a signal from at least one circuit positioned on a first die lying within a first geometric plane, detect a signaling path between the at least one circuit positioned on the first die and at least one circuit positioned on a second die lying within a second geometric plane that is different from the first geometric plane, and control the one or more switches to route the signal along the signaling path. Circuits having a similar power characteristic are positioned adjacent to each other on the first die or the second die and circuits having a high temperature characteristic are positioned separate from each other on the first die or the second die.
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