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首页> 外文期刊>Emerging and Selected Topics in Power Electronics, IEEE Journal of >Statistical Analysis of the Electrothermal Imbalances of Mismatched Parallel SiC Power MOSFETs
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Statistical Analysis of the Electrothermal Imbalances of Mismatched Parallel SiC Power MOSFETs

机译:不匹配的并联SiC功率MOSFET电热不平衡的统计分析

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摘要

Thanks to the increasing availability of silicon carbide (SiC) metal oxide semiconductor field effect transistors (MOSFETs) with outstanding static and dynamic performances, the number of applications in which these devices are used is rapidly growing. Despite that, the maximum current rating of such devices is usually limited at few hundred amps, which sets an upper bound for the power level at which these transistors can be adopted. A viable solution to this problem consists in paralleling several SiC MOSFETs. However, the design of parallel configurations needs optimization since mismatched performances can cause the enhanced stress of a subset of devices, which can ultimately lead to premature failure of the whole module. In this contribution, several sets of Monte Carlo (MC) electrothermal simulations of parallel SiC MOSFETs are used to systematically relate the deviations of devices and circuit parameters to the resulting uneven power dissipation. To this purpose, a set of relevant parameters is identified and statistically described. Thereafter, the simulation of a 200-kHz synchronous buck converter relying on mismatched parallel MOSFETs is performed as a case study. Eventually, a methodology to derive a guideline for the design of reliable multichip configurations is developed. The methodology is based on the iteration of MC simulations for different tolerances of the parameters.
机译:由于具有出色的静态和动态性能的碳化硅(SiC)金属氧化物半导体场效应晶体管(MOSFET)的可用性不断提高,因此使用这些器件的应用数量正在迅速增长。尽管如此,这种设备的最大额定电流通常限制在几百安培,这为可采用这些晶体管的功率水平设定了上限。解决这个问题的可行方法是并联几个SiC MOSFET。但是,并行配置的设计需要优化,因为不匹配的性能会导致一部分设备的压力增加,最终可能导致整个模块的过早失效。在此贡献中,使用了几组并行SiC MOSFET的蒙特卡洛(MC)电热仿真,以系统地将器件和电路参数的偏差与产生的不均匀功耗相关联。为此,识别并统计描述一组相关参数。此后,作为案例研究,对依赖于不匹配的并联MOSFET的200kHz同步降压转换器进行了仿真。最终,开发出一种方法来得出可靠的多芯片配置设计指南。该方法基于针对不同参数公差的MC仿真的迭代。

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