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首页> 外文期刊>Electronics Letters >Thermal stability of Pd-In ohmic contacts to n-GaAs formed by scanned electron beam and rapid thermal annealing
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Thermal stability of Pd-In ohmic contacts to n-GaAs formed by scanned electron beam and rapid thermal annealing

机译:Pd-In欧姆接触对通过扫描电子束和快速热退火形成的n-GaAs的热稳定性

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摘要

Thermally stable and low resistance Pd-In ohmic contacts to n-GaAs were formed using scanned electron beam (SEB) and rapid thermal annealing (RTA). A specific contact resistance ( rho /sub c/) of the order of approximately 10/sup -6/ Omega cm/sup 2/ was obtained using both SEB and RTA techniques with SEB annealed contacts exhibiting a superior surface morphology. High temperature aging (500 degrees C) of the contacts showed that SEB annealed contacts were more stable than RTA contacts as shown by the increase in their respective rho /sub c/ values (an increase by a factor of approximately 5 for SEB annealed contacts against an increase by a factor of approximately 8 for RTA contacts after 25 hour s of aging).
机译:使用扫描电子束(SEB)和快速热退火(RTA)形成与n-GaAs的热稳定且低电阻的Pd-In欧姆接触。使用SEB和RTA技术均获得了约10 / sup -6 /Ωcm / sup 2 /量级的比接触电阻(rho / sub c /),其中SEB退火的接触件表现出优异的表面形态。触点的高温老化(500摄氏度)表明,SEB退火触点比RTA触点更稳定,如其各自的rho / sub c /值的增加所表明(SEB退火触点相对于RTA触点的升高约5倍)老化25小时后,RTA触点增加大约8倍)。

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