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Electrical isolation of n-type InP using MeV iron implantation at different doses and substrate temperatures

机译:使用MeV铁注入在不同剂量和衬底温度下对n型InP进行电隔离

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摘要

An effective inter-device isolation has been obtained by implanting iron into n-type InP. The effect of 1 MeV iron (Fe) implantation into n-type InP at 77 K, room temperature (RT) and 200/spl deg/C has been investigated with various ion doses in the range of 1 /spl times/ 10/sup 12/ to 1 /spl times/ 10/sup 15//cm/sup 2/. It is found that RT and 77 K implants show better isolation than 200/spl deg/C implants. Rutherford backscattering spectrometry (RBS) is used to gain a better understanding of the isolation mechanisms.
机译:通过将铁注入n型InP,可以获得有效的器件间隔离。已经研究了在1 K / spl次/ 10 / sup范围内的各种离子剂量下,在77 K,室温(RT)和200 / spl deg / C下将1 MeV铁(Fe)注入n型InP的效果。 12 /至1 / spl次/ 10 / sup 15 // cm / sup 2 /。发现RT和77 K植入物的隔离度优于200 / spl deg / C植入物。卢瑟福背散射光谱(RBS)用于更好地了解隔离机制。

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