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Lasers lead the way for microvias

机译:激光引领微孔的发展

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摘要

Although mechanical drilling still accounts for more than 90% of all holes drilled in PCBs, it has never been a serious contender as a method of microvia formation. For hole diameters below 100um, three technologies present solutions: plasma etch, photo-imaging and laser drilling. Each has its benefits and drawbacks, but market reports indicate that laser drilling is easing ahead as the primary method of microvia production.
机译:尽管机械钻孔仍占PCB上所有钻孔的90%以上,但从微孔形成的角度来看,机械钻孔从未成为竞争者。对于直径小于100um的孔,提供了三种技术解决方案:等离子蚀刻,光成像和激光钻孔。每种方法都有其优点和缺点,但是市场报告表明,激光打孔作为微通孔生产的主要方法正在逐渐减少。

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