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Copper foils for a new area of flexible printed circuit processing

机译:铜箔用于柔性印刷电路加工的新领域

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摘要

Smaller, lighter, higher performance and cost reductions-with ultra thin treated copper foils down to 0.01 mm, the performance requirements of the electronics industry can be fulfilled. After years of overheated market demands in the electronics industry, the order to invoice ratio, as well as the incoming orders dropped to an all time low. Of course, on one hand this situation is depressing after years of rapid growth rates, but on the other hand there is a positive aspect to it. In the last few years there was never enough time for the development of new products. Current low market levels gives us time for such developments, as well as improvements to existing products, which can be ready for the time when the market recovers.
机译:更小,更轻,更高的性能并降低了成本-使用最小至0.01 mm的超薄处理铜箔,可以满足电子行业的性能要求。在电子行业经过多年过热的市场需求之后,订单与发票的比率以及收到的订单均降至历史最低水平。当然,一方面,这种情况在经过多年的快速增长后令人沮丧,但另一方面,它具有积极的一面。在过去的几年中,没有足够的时间来开发新产品。当前的低市场水平使我们有时间进行此类开发以及对现有产品进行改进,这可以为市场复苏做好准备。

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