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The Role of Optics in High-Speed interconnects

机译:光学在高速互连中的作用

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Welcome to our special focus on Advanced Interconnects, a joint supplement between Semiconductor International and EP&P. As the world moves to faster communications, a greater focus will be on the interconnects used on the chip, within the package and on the board. We begin with an interview with Professor Lionel C. Kimerling, director of the Microphotonics Center at the Massachusetts Institute of Technology (MIT, Cambridge, Mass.). The goal of the Microphotonics Center is the creation of new materials, structures and architectures to enable the evolution of photonics from discrete devices to integrated photonic systems. High dielectric contrast materials combinations enable smaller devices, lower power transduction and higher local fields to drive nonlinear interactions.
机译:欢迎来到我们对高级互连的特别关注,这是国际半导体公司与EP&P之间的联合补充。随着世界朝着更快的通信方向发展,更大的重点将放在芯片,封装和板上的互连上。首先,我们采访了麻省理工学院(麻省理工学院,麻省理工学院)微光子学中心主任Lionel C. Kimerling教授。微光子学中心的目标是创造新的材料,结构和架构,以使光子学从分立器件发展为集成光子系统。高介电对比材料的组合使更小的设备,更低的功率转换和更高的局部场能够驱动非线性相互作用。

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