Advances in high speed ADCs directly translate to perfor-mance improvements in both the receive (Rx) and transmit (Tx) paths of third generation (3G) basestations such as WCDMA, TD-SCDMA and UMTS. Along with the increasing need for low power operation, the small size of new basestation designs places additional demands on the thermal performance of signal chain components. Small, low power ADCs that require minimal power while achieving high performance run cool and save additional board space that would otherwise be required for dissipation of heat.
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