VIRTUAL PROTOTYPING FOR THERMAL MANAGEMENT FOR ADVANCED ELECTRONICS PACKAGING

摘要

Emerging mixed technology multi-chip packages integrate several active and passive devices in a small footprint single substrate and are driven at ever increasing frequencies and operate at high power densities. Fabrication and design of these devices heavily relies on trial and error tests as no reliable mixed technology packaging CAD tools are currently available. This paper presents a new concept of Virtual Prototyping of electronics packaging and demonstrates it on the thermal manage- ment of microelectronic devices/packages/systems.