A design model for surface-termination optimization of off-state semiconductor devices

摘要

An optimization design model for surface termination of off-state semiconductor devices under reverse-bias conditions is presented. The multivariable design model is used to optimize the surface profile shapes for nonplanar devices and the doping profiles of material regions along the surface for planar devices. The effectiveness of the design model in reducing the peak surface electric field to below 50% of the bulk value is demonstrated for two examples of each type of device.