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首页> 外文期刊>IEEE Transactions on Electron Devices >Simulation and two-dimensional analytical modeling of subthreshold slope in ultrathin-film SOI MOSFETs down to 0.1 mu m gate length
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Simulation and two-dimensional analytical modeling of subthreshold slope in ultrathin-film SOI MOSFETs down to 0.1 mu m gate length

机译:栅极长度低至0.1μm的超薄膜SOI MOSFET亚阈值斜率的仿真和二维分析建模

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摘要

The subthreshold slope in ultra-thin-film fully depleted SOI MOSFETs is investigated for channel lengths from the long channel region down to 0.1 mu m. A doping effect is found which allows improvement of the S-factor by increasing the channel doping concentration. In order to explain this phenomenon and to clarify the mechanism of S-factor degradation at short gate lengths, a two-dimensional analytical model is developed. A modified boundary condition for the two-dimensional Poisson equation is introduced to account for the nonlinear potential distribution inside the buried oxide. It is found that the S-factor short-channel degradation is governed by three mechanisms: the rise of capacitances at the channel source and drain ends due to the two-dimensional potentional distribution; the subthreshold current flow at the back channel surface; and the modulation of the effective current channel thickness during the gate voltage swing in the subthreshold region. The analytical model results are compared to those of numerical device simulation, and a good agreement is found.
机译:研究了超薄膜全耗尽SOI MOSFET的亚阈值斜率,其沟道长度从长沟道区一直到0.1μm。发现了掺杂效应,其可以通过增加沟道掺杂浓度来改善S因子。为了解释该现象并阐明短浇口长度时S因子降解的机理,建立了二维分析模型。引入了二维泊松方程的修正边界条件,以说明掩埋氧化物内部的非线性电势分布。发现S因子短沟道的劣化受三种机制控制:由于二维电位分布而引起的沟道源极和漏极端电容的增加;亚阈值电流在反向通道表面流动;以及在亚阈值区域内栅极电压摆幅期间有效电流沟道厚度的调制。将解析模型的结果与数值设备仿真的结果进行了比较,发现了很好的一致性。

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