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Electroluminescence characteristics and current-conduction mechanism of a-SiC:H p-i-n thin-film light-emitting diodes with barrier layer inserted at p-i interface

机译:在p-i界面处插入势垒层的a-SiC:H p-i-n薄膜发光二极管的电致发光特性和导电机理

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In order to improve the electroluminescence (EL) characteristics of the hydrogenated amorphous silicon carbide (a-SiC:H) p-i-n thin-film light-emitting diode (TFLED), a barrier layer (BL) was inserted at its p-i interface to enhance the hole injection efficiency under forward-bias operation. The a-SiC:H TFLED's with various optical gaps of BL had been fabricated and characterized. In addition, a composition-graded n/sup +/-layer was used to reduce its series and contact resistances to the Al electrode and hence the EL threshold voltage (V/sub th/) of an a-SiC:H BL TFLED. The highest obtainable brightness of an a-SiC:H BL TFLED was 342 cd/m/sup 2/ at an injection current density of 600 mA/cm/sup 2/ and the lowest EL V/sub th/ achievable was 6.0 V. The current-conduction mechanism of an a-SiC:H BL TFLED had also been investigated. Within the lower applied-bias region, it showed an ohmic current, while within the higher applied-bias region, a space-charge-limited current (SCLC) was observed.
机译:为了改善氢化非晶碳化硅(a-SiC:H)引脚薄膜发光二极管(TFLED)的电致发光(EL)特性,在其pi界面处插入了一个势垒层(BL)以增强发光强度。正偏操作下的空穴注入效率。制备并表征了具有各种BL光学间隙的a-SiC:H TFLED。另外,使用成分分级的n / sup +/-层来减小其与Al电极的串联电阻和接触电阻,从而减小a-SiC:H BL TFLED的EL阈值电压(V / sub /)。在注入电流密度为600 mA / cm / sup 2 /的情况下,a-SiC:H BL TFLED可获得的最高亮度为342 cd / m / sup 2 /,可实现的最低EL V / subth /为6.0V。还研究了a-SiC:H BL TFLED的电流传导机理。在较低的施加偏置区域内,它显示了欧姆电流,而在较高的施加偏置区域内,则显示了空间电荷限制电流(SCLC)。

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