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An analytical model for determining carrier transport mechanism of polysilicon emitter bipolar transistors

机译:确定多晶硅发射极双极型晶体管载流子传输机理的解析模型

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An analytical model is proposed by including carrier transport mechanisms which previous unified analytical models do not consider: minority carrier combination at both sides of polysilicon-silicon interfacial oxides and thermionic emission over segregation potential barriers for determining the precise carrier transport mechanisms which govern current gain and specific emitter interfacial resistivity. This approach allows us to gain an insight into carrier transport mechanisms and provides a distinct image for polysilicon emitter bipolar devices. With the consideration of the interfacial capture cross section as a function of temperature, the dependence of current gain for devices given an HF etch prior to polysilicon deposition on temperature is first explained successfully. For improving device performance, some directive suggestions are presented.
机译:提出了一种分析模型,其中包括载流子传输机制,而以前的统一分析模型并未考虑这些载流子传输机制:多晶硅-硅界面氧化物两侧的少数载流子组合以及偏析势垒上的热电子发射,用于确定控制电流增益和电流的精确载流子传输机制。比发射极的界面电阻率。这种方法使我们能够深入了解载流子传输机制,并为多晶硅发射极双极型器件提供独特的图像。考虑到界面俘获截面随温度的变化,首先成功地解释了在多晶硅沉积之前进行HF蚀刻的器件的电流增益对温度的依赖性。为了提高设备性能,提出了一些指导性建议。

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