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Photo-CVD SiO/sub 2/ layers on AlGaN and AlGaN-GaN MOSHFET

机译:AlGaN和AlGaN-GaN MOSHFET上的光CVD SiO / sub 2 /层

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摘要

High-quality SiO/sub 2/ was successfully deposited onto AlGaN by photochemical vapor deposition (photo-CVD) using a D/sub 2/ lamp as the excitation source. The resulting interface state density was only 1.1 /spl times/ 10/sup 11/ cm/sup -2/eV/sup -1/, and the oxide leakage current was dominated by Poole-Frenkel emission. Compared with AlGaN-GaN metal-semiconductor HFET (MESHFETs) with similar structure, the gate leakage current is reduced by more than four orders of magnitude by using the photo-CVD oxide layer as gate oxide in AlGaN-GaN metal-oxide-semiconductor heterojunction field-effect transistors (MOSHFETs). With a 2-/spl mu/m gate, the saturated I/sub ds/, maximum g/sub m/ and gate voltage swing (GVS) of the fabricated nitride-based MOSHFET were 572 mA/mm, 68 mS/mm, and 8 V, respectively.
机译:使用D / sub 2 /灯作为激发源,通过光化学气相沉积(photo-CVD)将高质量的SiO / sub 2 /成功地沉积到AlGaN上。所得的界面态密度仅为1.1 / spl倍/ 10 / sup 11 / cm / sup -2 / eV / sup -1 /,并且氧化物泄漏电流主要由Poole-Frenkel发射决定。与结构相似的AlGaN-GaN金属半导体HFET(MESHFET)相比,通过在AlGaN-GaN金属氧化物半导体异质结中使用光CVD氧化物层作为栅极氧化物,栅漏电流降低了四个数量级以上场效应晶体管(MOSHFET)。使用2- / spl mu / m栅极时,所制造的基于氮化物的MOSHFET的饱和I / sub ds /,最大g / sub m /和栅极电压摆幅(GVS)为572 mA / mm,68 mS / mm,和8 V分别。

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