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Dual-Material-Gate Technique for Enhanced Transconductance and Breakdown Voltage of Trench Power MOSFETs

机译:双材料门技术可增强沟道功率MOSFET的跨导和击穿电压

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In this brief, we propose a new dual-material-gate-trench power MOSFET that exhibits a significant improvement in its transconductance and breakdown voltage without any degradation in on-resistance. In the proposed structure, we have split the gate of a conventional trench MOSFET structure into two parts for work-function engineering. The two gates share the control of the inversion charge in the channel. By using 2-D numerical simulation, we have shown that by adjusting the lengths of the two gates to allow equal share of the inversion charge by them, we get the optimum device performance. By using $hbox{N}^{+}$ poly-Si as a lower gate material and $hbox{P}^{+}$ poly-Si as an upper gate material, approximately 44% improvement in peak transconductance and 20% improvement in breakdown voltage may be achieved in the new device compared to the conventional trench MOSFET.
机译:在本简介中,我们提出了一种新型的双材料栅极沟道功率MOSFET,该晶体管在跨导和击穿电压方面表现出显着改善,而导通电阻没有任何下降。在提出的结构中,我们将常规沟槽MOSFET结构的栅极分为两部分,用于功函数工程。两个门共享通道中反相电荷的控制。通过使用二维数值模拟,我们已经表明,通过调节两个栅极的长度以允许它们平均分配反相电荷,我们可以获得最佳的器件性能。通过使用$ hbox {N} ^ {+} $多晶硅作为下栅极材料和$ hbox {P} ^ {+} $多晶硅作为上栅极材料,峰值跨导提高约44%,峰值导通率提高20%与常规沟槽MOSFET相比,新器件可以实现击穿电压的改善。

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