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Temperature-Oriented Mobility Measurement and Simulation to Assess Surface Roughness in Ultrathin-Gate-Oxide ( $sim$1 nm) nMOSFETs and Its TEM Evidence

机译:评估超薄栅极氧化物($ sim $ 1 nm)nMOSFET的表面粗糙度的面向温度的迁移率测量和仿真及其TEM证据

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摘要

On a 1.27-nm gate-oxide nMOSFET, we make a comprehensive study of $ hbox{SiO}_{2}hbox{/Si}$ interface roughness by combining temperature-dependent electron mobility measurement, sophisticated mobility simulation, and high-resolution transmission electron microscopy (TEM) measurement. Mobility measurement and simulation adequately extract the correlation length $lambda$ and roughness rms height $Delta$ of the sample, taking into account the Coulomb-drag-limited mobilities in the literature. The TEM measurement yields the apparent correlation length $ lambda_{m}$ and roughness rms height $Delta_{m}$ . It is found that the following hold: 1) $lambda approx lambda_{m}$ for both the Gaussian and exponential models, validating the temperature-oriented extraction process; 2) the extracted $Delta$ ($sim !!hbox{1.3} hbox{rm{AA}}$ for the Gaussian model and 1.0 $hbox{rm{AA}}$ for the exponential one) is close to that $( sim!! hbox{1.2} hbox{rm{AA}})$ of $Delta_{m}$, all far less than the conventional values $(sim!hbox{3} hbox{ rm{AA}})$ in thick-gate-oxide case; and 3) the TEM 2-D projection correction coefficient $Delta_{m}/Delta$ is approximately 1.0, which cannot be elucidated with the current thick-gate-oxide-based knowledge.
机译:在1.27 nm栅极氧化物nMOSFET上,我们结合了温度依赖性电子迁移率测量,复杂的迁移率模拟和高分辨率,对$ hbox {SiO} _ {2} hbox {/ Si} $界面粗糙度进行了全面研究透射电子显微镜(TEM)测量。考虑到文献中的库仑阻力限制的迁移率,迁移率的测量和模拟可以充分提取出样本的相关长度$ lambda $和粗糙度rms高度$ Delta $。 TEM测量得到表观相关长度$ lambda_ {m} $和粗糙度均方根高度$ Delta_ {m} $。发现存在以下条件:1)对于高斯模型和指数模型都使用$ lambda近似lambda_ {m} $,从而验证了面向温度的提取过程; 2)提取的$ Delta $(对于高斯模型为$ sim !! hbox {1.3} hbox {rm {AA}} $,对于指数模型为1.0 $ hbox {rm {AA}} $)接近于$( sim !! hbox {1.2} hbox {rm {AA}})$的$ Delta_ {m} $,都远小于传统值$(sim!hbox {3} hbox {rm {AA}})$的厚度-门氧化物的情况; 3)TEM 2-D投影校正系数$ Delta_ {m} / Delta $约为1.0,而当前基于厚栅氧化物的知识尚无法阐明。

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