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Vertical Diamond Schottky Barrier Diode Fabricated on Insulating Diamond Substrate Using Deep Etching Technique

机译:利用深蚀刻技术在绝缘金刚石基板上制备垂直金刚石肖特基势垒二极管

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Diamond Schottky barrier diodes (SBDs) with vertical channel structures are fabricated on an insulating diamond substrate. The deep etching technique is used to make a vertical channel structure in the diamond stacking layers of the ${rm p}^{+}/{rm p}^{-}$/insulating substrate. Mo Schottky electrodes with the ${rm Al}_{2}{rm O}_{3}$ field plate structure are also fabricated to realize a high breakdown voltage. As a result, I–V characteristics with a high forward current density ${>}10^{3}{rm A}/{rm cm}^{2}$ and a high breakdown voltage ${>}{rm 700}~{rm V}$ are obtained at 25$^{circ}{rm C}$ and 250 $^{circ}{rm C}$. Baliga's figure of merit is 332 ${rm MW}/{rm cm}^{2}$, which is equivalent to the high value previously reported for diamond SBDs with lateral channel or pseudovertical channel structures, and is also ten times higher than the limit of Si SBDs. High-power diamond SBDs are expected to be realized on a large area insulating diamond substrate using this technique.
机译:具有垂直沟道结构的金刚石肖特基势垒二极管(SBD)被制造在绝缘金刚石基板上。深腐蚀技术用于在$ {rm p} ^ {+} / {rm p} ^ {-} $ /绝缘基板的金刚石堆叠层中形成垂直通道结构。还制造了具有$ {rm Al} _ {2} {rm O} _ {3} $场板结构的Mo Schottky电极,以实现高击穿电压。结果,IV特性具有高正向电流密度$ {>} 10 ^ {3} {rm A} / {rm cm} ^ {2} $和高击穿电压$ {>} {rm 700}以25 $ ^ {circ} {rm C} $和250 $ ^ {circ} {rm C} $获得〜{rm V} $。 Baliga的品质因数为332 $ {rm MW} / {rm cm} ^ {2} $,这相当于先前报道的具有横向通道或伪垂直通道结构的金刚石SBD的高价值,并且也高出10倍。 Si SBD的限制。使用该技术,有望在大面积的绝缘金刚石基板上实现大功率金刚石SBD。

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