首页> 外文期刊>Electron Devices, IEEE Transactions on >Endurance/Retention Trade-off on src='/images/tex/20778.gif' alt='hbox {HfO}_{2}/hbox {Metal}'> Cap 1T1R Bipolar RRAM
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Endurance/Retention Trade-off on src='/images/tex/20778.gif' alt='hbox {HfO}_{2}/hbox {Metal}'> Cap 1T1R Bipolar RRAM

机译: src =“ / images / tex / 20778.gif” alt =“ hbox {HfO} _ {2} / hbox {Metal}”> 第1T1R章双极RRAM

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The endurance/retention performance of $hbox{HfO}_{2}/break hbox{Metal}$ cap RRAM devices in a 1T1R configuration shows metal cap dependence. For Hf and Ti caps, owning strong thermodynamic ability of extracting oxygen from $hbox{HfO}_{2}$ , long pulse endurance $(>hbox{10}^{10} hbox{cycles})$ could be achieved. For Ta cap, owning lower thermodynamic ability of extracting oxygen from $hbox{HfO}_{2}$, better retention can be achieved. Therefore, an endurance/retention performance tradeoff is identified on the 40 nm $times$ 40 nm $hbox{HfO}_{2}/hbox{Metal}$ cap bipolar RRAM devices. The tradeoff of endurance/retention performance can be explained by a different filament constriction shape depending on metal cap layer as derived from fitting $I$– $V$ curves in the quantum point contact model. This difference in filament constriction shape is attributed to the thermodynamics difference of metal cap: Hf and Ti have a stronger thermodynamical ability to extract oxygen from $hbox{HfO}_{2}$ than Ta. The possibility of tuning the intrinsic reliability performance by changing the cap materials paves a way for optimizing the operation of RRAM devices into the desired specifics.
机译:在1T1R配置中,$ hbox {HfO} _ {2} / break hbox {Metal} $上限RRAM器件的耐久/保留性能显示出金属上限的依赖性。对于Hf和Ti瓶盖,由于具有强大的从$ hbox {HfO} _ {2} $提取氧气的热力学能力,因此可以实现长脉冲耐力$(> hbox {10} ^ {10} hbox {cycles))$。对于Ta cap,由于具有较低的从$ hbox {HfO} _ {2} $中提取氧气的热力学能力,因此可以实现更好的保留。因此,在容量为40 nm x乘以40 nm hbox {HfO} _ {2} / hbox {Metal} $的双极RRAM器件上,要确定耐久性/保留性能的权衡。耐久力/保持性能的折衷可以用不同的灯丝收缩形状来解释,该形状取决于金属帽层,这是根据量子点接触模型中拟合$ I $ – $ V $曲线得出的。细丝收缩形状的这种差异归因于金属帽的热力学差异:Hf和Ti具有比Ta更强的热力学能力,可从$ hbox {HfO} _ {2} $中提取氧气。通过改变盖材料来调节固有可靠性性能的可能性为将RRAM器件的操作优化到所需的规格铺平了道路。

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