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Modeling of SiC IGBT Turn-Off Behavior Valid for Over 5-kV Circuit Simulation

机译:适用于5 kV以上电路仿真的SiC IGBT关断行为建模

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This paper presents a compact model of SiC insulated-gate bipolar transistors (IGBTs) for power electronic circuit simulation. Here, we focus on the modeling of important specific features in the turn-off characteristics of the 4H-SiC IGBT, which are investigated with a 2-D device simulator, at supply voltages higher than 5 kV. These features are found to originate from the punch-through effect of the SiC IGBT. Thus, they are modeled based on the carrier distribution change caused by punch through and implemented into the silicon IGBT model named “HiSIM-IGBT” to obtain a practically useful SiC-IGBT model. The developed compact SiC-IGBT model for circuit simulation is verified with the 2-D device simulation data.
机译:本文提出了用于功率电子电路仿真的SiC绝缘栅双极晶体管(IGBT)的紧凑模型。在这里,我们着重于4H-SiC IGBT的关断特性中重要的特定特征的建模,这是通过2D器件模拟器在供电电压高于5 kV时进行研究的。发现这些特征源自SiC IGBT的穿通效应。因此,基于由穿通引起的载流子分布变化对它们进行建模,并将其实施到名为“ HiSIM-IGBT”的硅IGBT模型中,以获得实用的SiC-IGBT模型。利用二维器件仿真数据验证了开发的用于电路仿真的紧凑型SiC-IGBT模型。

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