Thermal Analysis of a Multichip Light-Emitting Diode Device With Different Chip Arrays

摘要

With the emergence of a multichip Light-emitting diodes (LEDs) device based on different chip arrays, a new modeling for a multichip LED device with different array becomes urgent. This paper presents a compact thermal model (CTM) for the multichip LED device with different chip array for nonuniform thermal properties. Based on a general 3-D CTM, LED chips can be arranged in various array forms according to the multichip LED construction design. By linking the thermal matrix to junction temperature prediction, the proposed CTM provides accurate predictions of temperature distribution of the multichip LED device, compared to the practical physical model and infrared radiation measurement. The modeling technique has been successfully demonstrated and verified. Based on the proposed method, this paper presents the multichip LED device with a staggered array to optimize the LED positions so that heat concentration of the LED array can be reduced.