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Quasi-Schottky-Barrier UTBB SOI MOSFET for Low-Power Robust SRAMs

机译:适用于低功率鲁棒SRAM的准肖特基势垒UTBB SOI MOSFET

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摘要

This paper presents a low-power robust static random access memory (SRAM) using a novel quasi-Schottky-barrier ultrathin body and ultrathin buried oxide (UTBB) silicon-on-insulator (SOI) device. In the proposed device, the drain terminal is highly doped and a metallic source terminal is used. Given the proposed structure, asymmetric characteristics will be achieved according to the drain-source bias voltage (VDS). These characteristics of the proposed device are extensively analyzed and compared with a conventional symmetric UTBB SOI device. The asymmetry nature of the proposed device will lead to the mitigated read-write conflict of the 6T-SRAM cell. The simulation results show a leakage reduction of 18% at VDD = 1 V in comparison with the 6T-SRAM cell realized by conventional symmetric UTBB SOI device. Furthermore, in comparison with the conventional 6T-SRAM, the realized cell shows a 54% improvement in read static noise margin, 6.6% higher write margin, and 3.1× faster write at the cost of a longer access time. To achieve a practical read access time, we utilize split bitline approach.
机译:本文提出了一种使用新型准肖特基势垒超薄体和超薄埋式氧化物(UTBB)绝缘体上硅(SOI)器件的低功耗鲁棒静态随机存取存储器(SRAM)。在所提出的装置中,漏极端子是高掺杂的,并且使用金属源极端子。给定建议的结构,将根据漏极-源极偏置电压(VDS)实现不对称特性。所提出的器件的这些特性已得到广泛分析,并与传统的对称UTBB SOI器件进行了比较。所提出的设备的不对称性将导致6T-SRAM单元的读写冲突得到缓解。仿真结果表明,与传统的对称UTBB SOI器件实现的6T-SRAM单元相比,在VDD = 1 V时,泄漏减少了18%。此外,与传统的6T-SRAM相比,实现的单元在读取静态噪声容限方面提高了54%,在写入容限方面提高了6.6%,在写入速度方面提高了3.1倍,但需要更长的访问时间。为了达到实际的读取访问时间,我们使用了分割位线方法。

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