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ACO-Based Thermal-Aware Thread-to-Core Mapping for Dark-Silicon-Constrained CMPs

机译:基于ACO的热感知线程到内核的映射,用于深色硅约束的CMP

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The limitation on thermal budget in chip multiprocessor (CMP) results in a fraction of inactive silicon regions called dark silicon, which significantly impacts the system performance. In this paper, we propose a thread-to-core mapping method for dark-silicon-constrained CMPs to address their thermal issue. We first propose a thermal prediction model to forecast CMP temperature after the CMP executes a forthcoming application. Then, we develop an ant colony optimization-based algorithm to conduct the thread-to-core mapping process, such that the CMP peak temperature is minimized and, consequently, the probability of triggering CMP dynamic thermal management is decreased. Finally, we evaluate our method and compare it with the baseline (a standard Linux scheduler) and other existing methods (NoC-Sprinting, DaSiM mapping, and TP mapping). The simulation results show that our method gains good thermal profile and computational performance, and performs well with chip scaling. Specifically, it eliminates all thermal emergency time, outperforming all other methods, and gains million instructions per second improvement up to 12.9% against the baseline.
机译:芯片多处理器(CMP)中对热预算的限制导致一部分不活跃的硅区域(称为深色硅),这会严重影响系统性能。在本文中,我们提出了一种针对深色硅约束的CMP的线程到内核的映射方法,以解决其散热问题。在CMP执行即将推出的应用程序之后,我们首先提出一种热预测模型来预测CMP温度。然后,我们开发了一种基于蚁群优化的算法来进行线程到核心的映射过程,从而使CMP峰值温度最小化,从而降低了触发CMP动态热管理的可能性。最后,我们评估我们的方法并将其与基线(标准Linux调度程序)和其他现有方法(NoC-Sprinting,DaSiM映射和TP映射)进行比较。仿真结果表明,我们的方法获得了良好的热剖面和计算性能,并且在芯片缩放方面表现良好。具体而言,它消除了所有热紧急时间,优于其他所有方法,并且每秒获得百万条指令的改进,相对于基准提高了12.9%。

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