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Prospects for Wide Bandgap and Ultrawide Bandgap CMOS Devices

机译:宽带隙和超空手隙CMOS器件的前景

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Power and RF electronics applications have spurred massive investment into a range of wide and ultrawide bandgap semiconductor devices which can switch large currents and voltages rapidly with low losses. However, the end systems using these devices are often limited by the parasitics of integrating and driving these chips from the silicon complementary metal-oxide-semiconductor-based design (CMOS) circuitry necessary for complex control logic. For that reason, implementation of CMOS logic directly in the wide bandgap platform has become a way for each maturing material to compete. This review examines potential CMOS monolithic and hybrid approaches in a variety of wide bandgap materials.
机译:电源和RF电子应用将巨大的投资施用于一系列宽和超空格的带隙半导体器件,可以快速地用低损耗切换大电流和电压。然而,使用这些装置的最终系统通常受到从基于硅互补金属氧化物半导体的设计(CMOS)电路的整合和驱动这些芯片的寄生件限制。因此,直接在宽带隙平台中实现CMOS逻辑已成为竞争每种成熟材料的方式。该审查审查了各种宽带隙材料中的潜在CMOS单片和混合方法。

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